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| EMIF03-SIM02M8 3 line IPADTM, EMI filter for SIM card applications Features 8 1 GND SIM card EMI low-pass filter High efficiency in EMI filtering Very low PCB space consumption: 1.7 mm x 1.5 mm Very thin package: 0.6 mm max High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4). High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging. Lead free package Easy layout and flexibility thanks to I/O topology Low clamping voltage Figure 1. Vcc 7 6 5 2 3 4 GND Micro QFN 1.7 mm x 1.5 mm (bottom view) Pin configuration (top view) Vcc CLK in Data in GND RST in RST EXT CLK EXT Data EXT Complies with following standards IEC 61000-4-2 level 4 external pins - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 2 internal pins - 2 kV (air discharge) - 2 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A (all pins) Figure 2. RST in Device configuration Vcc 100 R1 RST ext CLK in 47 R2 CLK ext Data in 100 R3 Data ext Applications Where EMI filtering in ESD sensitive equipment is required: GND Maximum line capacitance = 20 pF Keyboard for mobile phones Computers and printers Communication systems MCU boards Description The EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external pins. TM: IPAD is a trademark of STMicroelectronics October 2007 Rev 1 1/10 www.st.com Characteristics EMIF03-SIM02M8 1 Table 1. Symbol Characteristics Absolute ratings (limiting values at Tamb = 25 C unless otherwise specified) Parameter Internal pins ESD discharge IEC 61000-4-2 air discharge ESD discharge IEC 61000-4-2 contact discharge External pins and VCC ESD discharge IEC 61000-4-2 air discharge ESD discharge IEC 61000-4-2 contact discharge All pins MIL STD 883G - Method 3015-7 Class 3A (human body model) Junction temperature Operating temperature range Storage temperature range Value 2 2 15 8 4 125 -40 to + 85 -55 to +150 C C C kV Unit VPP Tj Top Tstg Table 2. Symbol VBR IRM VRM VCL IPP RI/O Cline Symbol VBR IRM R1, R3 R2 Cline Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V Tolerance 20% Tolerance 20% VR= 0 V, F = 1 MHz, VOSC = 30 mV 100 47 17 20 Min. 6 Typ. IPP VBR VCL VRM IRM IR VF V I IF Max. 7.9 0.2 Unit V A pF 2/10 EMIF03-SIM02M8 Characteristics Figure 3. 0.00 S21(db) attenuation (RST line) Figure 4. 0.00 S21(db) attenuation (CLK line) dB dB -5.00 -5.00 -10.00 -10.00 -15.00 -15.00 -20.00 -20.00 -25.00 -25.00 -30.00 -30.00 F (Hz) -35.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G -35.00 300.0k 1.0M 3.0M 10.0M F (Hz) 30.0M 100.0M 300.0M 1.0G 3.0G Figure 5. 0.00 S21(db) attenuation (DATA line) Figure 6. 0.00 -10.00 Analog cross talk measurements dB dB -5.00 -20.00 -30.00 -10.00 -40.00 -50.00 -15.00 -60.00 -20.00 -70.00 -80.00 -25.00 -90.00 -100.00 -30.00 -110.00 F (Hz) -35.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G F (Hz) 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M DataIn-Rst/Clk 1.0G 3.0G ClkIn-RstExt -120.00 300.0k Figure 7. ESD response to IEC 61000-4-2 (+15 kV air discharge) applied to external pin Figure 8. ESD response to IEC 61000-4-2 (-15 kV air discharge) applied to external pin 5 V/div 2 V/div 200 ns/div 2 V/div 5 V/div 200 ns/div 3/10 Application schematic EMIF03-SIM02M8 Figure 9. ESD response to IEC 61000-4-2 (+2 kV air discharge) applied to internal pin Figure 10. ESD response to IEC 61000-4-2 (-2 kV air discharge) applied to internal pin 5 V/div 2 V/div 5 V/div 20 ns/div 2 V/div 20 ns/div 2 Application schematic Figure 11. Application schematic SIM PROCESSOR Vcc RST in CLK in Data in Vcc RST EXT CLK EXT Data EXT SIM CONNECTOR 3 Ordering information scheme Figure 12. Ordering information scheme EMIF EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads yy xxx zz Mx 4/10 GND EMIF03-SIM02M8 Package information 4 Package information Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 3. QFN 1.7 x 1.5 package dimensions Dimensions Ref Millimeters MIN A A1 b D D2 E E2 e k L 0.20 0.25 0.30 0.35 0.30 0.9 0.50 0.00 0.15 TYP 0.55 0.02 0.18 1.70 1.00 1.50 0.40 0.40 0.08 0.10 0.12 0.14 0.50 0.12 1.10 0.35 MAX 0.60 0.05 0.25 MIN 0.20 0.00 0.06 inches TYP 0.22 0.01 0.07 0.67 0.39 0.59 0.16 0.16 0.24 0.43 MAX 0.24 0.02 0.10 Figure 13. Footprint (dimensions in mm) Figure 14. Marking HA Dot: Pin 1 Identification 5/10 Package information Figure 15. Tape and reel specification 1.5 +/- 0.1 EMIF03-SIM02M8 2.0+/-0.05 4.00+/-0.1 1.75 +/- 0.1 3.5 +/- 0.03 0.75 8.0 +/- 0.3 XX XX XX 1.90 1.70 User direction of unreeling 4.00 Note: Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 6/10 EMIF03-SIM02M8 Recommendation on PCB assembly 5 5.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 16. Stencil opening dimensions L T W b) General Design Rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T LxW Aspect Area = --------------------------- 0.66 2T ( L + W ) 2. Reference design a) b) Stencil opening thickness: 100 m Stencil opening for central exposed pad: Opening to footprint ratio is 50%. Example: Stencil opening L = 680 m, W = 300 m Footprint (see Figure 13) L = 1000 m, W = 400 m c) Stencil opening for leads: Opening to footprint ratio is 90%. Example: Stencil opening L = 570 m, W = 190 m Footprint (see Figure 13) L = 600 m, W = 200 m 5.2 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 7/10 Recommendation on PCB assembly EMIF03-SIM02M8 5.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 5.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.5 Reflow profile Figure 17. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Temperature (C) 260C max 255C 220C 180C 125 C 2C/s recommended 2C/s recommended 6C/s max 6C/s max 3C/s max 3C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 90 sec max 6 7 Time (min) Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 EMIF03-SIM02M8 Ordering information 6 Ordering information Table 4. Ordering information Marking HA Package Micro QFN Weight 4 mg Base qty 3000 Delivery mode Tape and reel (7") Part number EMIF03-SIM02M8 7 Revision history Table 5. Date 07-Oct-2007 Document revision history Revision 1 Initial release. Changes 9/10 EMIF03-SIM02M8 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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